差分
この文書の現在のバージョンと選択したバージョンの差分を表示します。
muccra_chips [2010/10/17 05:59] wasmii |
muccra_chips [2011/04/05 07:19] (現在) |
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ライン 4: | ライン 4: | ||
* Date : 2006 | * Date : 2006 | ||
+ | * Die Size : 5.0 x 5.0[mm^2] | ||
* Process : Rohm 0.18um | * Process : Rohm 0.18um | ||
* No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
ライン 10: | ライン 11: | ||
* Context Size : 64 | * Context Size : 64 | ||
* Interconnect : Island style | * Interconnect : Island style | ||
- | |||
===== MuCCRA-2 ===== | ===== MuCCRA-2 ===== | ||
ライン 16: | ライン 16: | ||
* Date : 2007 | * Date : 2007 | ||
+ | * Die Size : 2.5 x 2.5[mm^2] | ||
* Process : ASPLA 90um | * Process : ASPLA 90um | ||
* No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
ライン 22: | ライン 23: | ||
* Context Size : 16 | * Context Size : 16 | ||
* Interconnect : Island style | * Interconnect : Island style | ||
- | |||
===== MuCCRA-3 ===== | ===== MuCCRA-3 ===== | ||
- | {{:muccra3_layout.jpg|MuCCRA-3 layout}} | ||
- | * Date : 2009 | + | {{:muccra_3_layout.png|}} |
+ | |||
+ | * Year : 2009 | ||
+ | * Die size : 2.1x4.2[mm^2] | ||
* Process : Fujitsu 65nm | * Process : Fujitsu 65nm | ||
* No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
ライン 35: | ライン 37: | ||
* Interconnect : Hybrid style(Island & Direct) | * Interconnect : Hybrid style(Island & Direct) | ||
+ | 2009年のICFPTにて,MuCCRA-3の実チップを用いてデモンストレーションを行いました. | ||
+ | カメラからの画像をリアルタイムに処理し,FPGAに対して約10倍の電力効率を達成できます. | ||
+ | |||
+ | We have MuCCRA-3 real chip demonstrated in ICFPT 2009, 2010. | ||
+ | In the demonstration, MuCCRA-3 processing image of captured from camera in real time. | ||
+ | it achieved x10 power-efficiency compared with Xilinx's virtex-5 FPGA which using same process technology. | ||
+ | |||
+ | {{:muccra_demo.png|}} | ||
+ | |||
+ | ====== MuCCRA-Cube ====== | ||
+ | {{:muccra_cube.png|}} | ||
+ | |||
+ | * Year : 2009 | ||
+ | * Die size : 2.1x4.2[mm^2] | ||
+ | * Process : Fujitsu 65nm | ||
+ | * No. of PE : 4 x 4 x 4 (4 chip stacked) | ||
+ | * PE style : Homogeneous | ||
+ | * Data Width : 16bit | ||
+ | * Context Size : 32 | ||
+ | * Interconnect : Hybrid style & Inductive Coupling | ||
+ | * | ||
+ | MuCCRA-Cube is a prototype chip for evaluation of chip-to-chip connection using | ||
+ | inductive coupling. The result of evaluation, it can achieved over 4Gbps throughput | ||
+ | without any bonding wires between chip and chip! |