差分
この文書の現在のバージョンと選択したバージョンの差分を表示します。
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muccra_chips [2010/10/17 06:02] wasmii |
muccra_chips [2011/04/05 07:19] (現在) |
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| ライン 4: | ライン 4: | ||
| * Date : 2006 | * Date : 2006 | ||
| + | * Die Size : 5.0 x 5.0[mm^2] | ||
| * Process : Rohm 0.18um | * Process : Rohm 0.18um | ||
| * No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
| ライン 10: | ライン 11: | ||
| * Context Size : 64 | * Context Size : 64 | ||
| * Interconnect : Island style | * Interconnect : Island style | ||
| - | |||
| ===== MuCCRA-2 ===== | ===== MuCCRA-2 ===== | ||
| ライン 16: | ライン 16: | ||
| * Date : 2007 | * Date : 2007 | ||
| + | * Die Size : 2.5 x 2.5[mm^2] | ||
| * Process : ASPLA 90um | * Process : ASPLA 90um | ||
| * No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
| ライン 22: | ライン 23: | ||
| * Context Size : 16 | * Context Size : 16 | ||
| * Interconnect : Island style | * Interconnect : Island style | ||
| + | |||
| ===== MuCCRA-3 ===== | ===== MuCCRA-3 ===== | ||
| - | {{:muccra3_layout.jpg|MuCCRA-3 layout}} | ||
| - | * Date : 2009 | + | {{:muccra_3_layout.png|}} |
| - | * Die size : 2.1x4.1[mm^2] | + | |
| + | * Year : 2009 | ||
| + | * Die size : 2.1x4.2[mm^2] | ||
| * Process : Fujitsu 65nm | * Process : Fujitsu 65nm | ||
| * No. of PE : 4 x 4 | * No. of PE : 4 x 4 | ||
| ライン 34: | ライン 37: | ||
| * Interconnect : Hybrid style(Island & Direct) | * Interconnect : Hybrid style(Island & Direct) | ||
| + | 2009年のICFPTにて，MuCCRA-3の実チップを用いてデモンストレーションを行いました． | ||
| + | カメラからの画像をリアルタイムに処理し，FPGAに対して約10倍の電力効率を達成できます． | ||
| + | |||
| + | We have MuCCRA-3 real chip demonstrated in ICFPT 2009, 2010. | ||
| + | In the demonstration, MuCCRA-3 processing image of captured from camera in real time. | ||
| + | it achieved x10 power-efficiency compared with Xilinx's virtex-5 FPGA which using same process technology. | ||
| + | |||
| + | {{:muccra_demo.png|}} | ||
| + | |||
| + | ====== MuCCRA-Cube ====== | ||
| + | {{:muccra_cube.png|}} | ||
| + | |||
| + | * Year : 2009 | ||
| + | * Die size : 2.1x4.2[mm^2] | ||
| + | * Process : Fujitsu 65nm | ||
| + | * No. of PE : 4 x 4 x 4 (4 chip stacked) | ||
| + | * PE style : Homogeneous | ||
| + | * Data Width : 16bit | ||
| + | * Context Size : 32 | ||
| + | * Interconnect : Hybrid style & Inductive Coupling | ||
| + | * | ||
| + | MuCCRA-Cube is a prototype chip for evaluation of chip-to-chip connection using | ||
| + | inductive coupling. The result of evaluation, it can achieved over 4Gbps throughput | ||
| + | without any bonding wires between chip and chip! | ||
