====== MuCCRA Chips ======
===== MuCCRA-1 =====
{{:muccra1_layout.jpg|MuCCRA-1 layout}}

  * Date : 2006
  * Die Size : 5.0 x 5.0[mm^2]
  * Process : Rohm 0.18um
  * No. of PE : 4 x 4
  * PE style : Heterogeneous
  * Data Width : 24bit
  * Context Size : 64
  * Interconnect : Island style

===== MuCCRA-2 =====
{{:muccra2_layout.jpg|MuCCRA-2 layout}}

  * Date : 2007
  * Die Size : 2.5 x 2.5[mm^2]
  * Process : ASPLA 90um
  * No. of PE : 4 x 4
  * PE style : Homogeneous
  * Data Width : 16bit
  * Context Size : 16
  * Interconnect : Island style

===== MuCCRA-3 =====

{{:muccra_3_layout.png|}}

  * Year : 2009
  * Die size : 2.1x4.2[mm^2]
  * Process : Fujitsu 65nm
  * No. of PE : 4 x 4
  * PE style : Homogeneous
  * Data Width : 16bit
  * Context Size : 32
  * Interconnect : Hybrid style(Island & Direct)

2009年のICFPTにて，MuCCRA-3の実チップを用いてデモンストレーションを行いました．
カメラからの画像をリアルタイムに処理し，FPGAに対して約10倍の電力効率を達成できます．

We have MuCCRA-3 real chip demonstrated in ICFPT 2009, 2010. 
In the demonstration, MuCCRA-3 processing image of captured from camera in real time.
it achieved x10 power-efficiency compared with Xilinx's virtex-5 FPGA which using same process technology.

{{:muccra_demo.png|}}

====== MuCCRA-Cube ======
{{:muccra_cube.png|}}

  * Year : 2009
  * Die size : 2.1x4.2[mm^2]
  * Process : Fujitsu 65nm
  * No. of PE : 4 x 4 x 4 (4 chip stacked)
  * PE style : Homogeneous
  * Data Width : 16bit
  * Context Size : 32
  * Interconnect : Hybrid style & Inductive Coupling
  *

MuCCRA-Cube is a prototype chip for evaluation of chip-to-chip connection using
inductive coupling. The result of evaluation, it can achieved over 4Gbps throughput 
without any bonding wires between chip and chip!